For a strong high temperature bond, PT-30 is specially formulated to continuously withstand temps of up to 300° celsius.

It has a high bonding rate to most non-woven materials and substrates.

PT-30 Thermoset AL-Composite PU/Phenolic (<0.3%) Blend

Sealing temp 170-200° C (338-392° F) under pressure, 3590 s depending on the substrate.

All of our adhesives are used and produced with a green, solvent free, footprint.